StarPower is a leading power module company headquartered in Jiaxing, China. Founded in 2005, StarPower designs and manufactures IGBT, MOSFET, IPM, FRD and Rectifier modules and customized modules for applications that include inverters, welding machines, inductive heating, UPS, EV, and solar/wind power, in the power range of 0.5kW up to more than 1MW.

StarPower Europe AG, with its head office in Switzerland, is the European subsidiary of StarPower Semiconductor Ltd. StarPower Europe recently announcement building a European development centre in Nuremberg, Germany. The goal is to test new technologies and materials, and provide the gained expertise to its headquarters for use in the production environment. A 240 m2 space accommodates the offices and laboratories. The process engineers and developers from headquarters are involved from the beginning and are trained in Nuremberg, so that the expertise can be easily transferred into the series production of semiconductor modules. StarPower sets a new milestone for its growth in Europe with high-quality semiconductor modules, using its European expertise.

Why Starpower:

Leading technology in High Powered IGBT (Modules 650-3300V & Discrete), MOSFETs, Bipolar & SiC Modules

Research & Development in Nuremburg Germany with manufacturing located in Jiaxing China. 3 operational fabs and New facility opened in Shanghai for focus on the EV market.

Heavy investments in R&D and development of new technologies—including “Sintering” and new die bonding.

Becoming 100% independent supplier. Star Power has control of own IGBT Chip Technology

Reliability, cost and lead time surpasses the competition with new chip technology

Excellence in Module Packaging

Chip-Sintering

  • Increase module reliability up to factor 3
  • Allows for higher TJ
  • Improves thermal resistance

Sinter Technology for high-performance inverters

Owing to Sinter Technology, two sintered half bridge IGBT modules with 700A in 17mm housing are replacing one 1400A high power module. With the use of sinter technology, the reliability can be improved significantly, compared with soldered modules. The lifetime of a high-performance inverter is increased due to the high contact strength between chip and substrate. Power cycling tests showed an up to 10 times higher lifetime. As the Chip temperature will be increased by 25°C to 175°C, the customer can, depending on the application, select between various options of either increasing the output power or to extend the lifetime. On the one hand the output power could be increased without impact in reliability, on the other hand the module could be operated at the previous temperature with an increased life time. This effect could also lead into cost effective module selections by using a smaller Chip.

Pressfit

  • Low thermal and electrical contact resistance
  • Gas-tight contact and high contact force
  • Increased system reliability, especially in harsh environment

PINFIN

  • The PINFIN heat sink geometry to provide increased surface area for heat transfer, low thermal resistance from base to fins
  • Lower thermal resistance → lower operating temperature or high power densities

TIM (Thermal Interface Material)

  • Soft or solid material depending on temperature requirements
  • higher output power, higher lifetime
  • High performance thermal paste with 30% improved Rthjs

StarPower Products

Power Semiconductors

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